JPH0451270B2 - - Google Patents

Info

Publication number
JPH0451270B2
JPH0451270B2 JP63163950A JP16395088A JPH0451270B2 JP H0451270 B2 JPH0451270 B2 JP H0451270B2 JP 63163950 A JP63163950 A JP 63163950A JP 16395088 A JP16395088 A JP 16395088A JP H0451270 B2 JPH0451270 B2 JP H0451270B2
Authority
JP
Japan
Prior art keywords
mirror
laser beam
workpiece
mask
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63163950A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0215887A (ja
Inventor
Hiroshi Ito
Shuichi Ishida
Yasutomo Fujimori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP63163950A priority Critical patent/JPH0215887A/ja
Publication of JPH0215887A publication Critical patent/JPH0215887A/ja
Publication of JPH0451270B2 publication Critical patent/JPH0451270B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP63163950A 1988-06-30 1988-06-30 レーザマーキング装置 Granted JPH0215887A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63163950A JPH0215887A (ja) 1988-06-30 1988-06-30 レーザマーキング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63163950A JPH0215887A (ja) 1988-06-30 1988-06-30 レーザマーキング装置

Publications (2)

Publication Number Publication Date
JPH0215887A JPH0215887A (ja) 1990-01-19
JPH0451270B2 true JPH0451270B2 (en]) 1992-08-18

Family

ID=15783904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63163950A Granted JPH0215887A (ja) 1988-06-30 1988-06-30 レーザマーキング装置

Country Status (1)

Country Link
JP (1) JPH0215887A (en])

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2520041B2 (ja) * 1989-08-31 1996-07-31 株式会社小松製作所 レ―ザ印字装置
US5653900A (en) * 1991-01-17 1997-08-05 United Distillers Plc Dynamic laser marking
JP3285214B2 (ja) * 1991-03-22 2002-05-27 株式会社日立製作所 レーザ加工用光学装置
JP2701183B2 (ja) * 1991-08-09 1998-01-21 株式会社小松製作所 液晶マスク式レーザマーカ
KR950704082A (ko) * 1992-11-25 1995-11-17 카타다 테쯔야 레이저마아킹장치 및 방법(laser marking apparatus and method)
TW245844B (en]) * 1993-01-29 1995-04-21 Komatsu Mfg Co Ltd
JPH0732169A (ja) * 1993-07-20 1995-02-03 Nec Corp レーザマーキング装置
US5801868A (en) * 1993-11-19 1998-09-01 Komatsu Ltd. Apparatus for and method of laser making
CN1159129C (zh) 2000-08-29 2004-07-28 三菱电机株式会社 激光加工装置
ES2223297B1 (es) * 2003-08-01 2005-12-16 Easy Laser, S.L. Sistema optico de giro, para marcacion angular flexible de tejidos y metodo correspondiente de marcacion.
JP4299185B2 (ja) * 2004-04-27 2009-07-22 株式会社ディスコ レーザー加工装置
KR100817825B1 (ko) * 2007-05-02 2008-03-31 주식회사 이오테크닉스 레이저 가공장치
CN102756206A (zh) * 2011-04-29 2012-10-31 深圳市大族激光科技股份有限公司 一种激光加工系统及其方法
US10583668B2 (en) 2018-08-07 2020-03-10 Markem-Imaje Corporation Symbol grouping and striping for wide field matrix laser marking

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5820404A (ja) * 1981-07-31 1983-02-05 高橋　喜一 自動竹片製造装置

Also Published As

Publication number Publication date
JPH0215887A (ja) 1990-01-19

Similar Documents

Publication Publication Date Title
JPH0451270B2 (en])
JP3213882B2 (ja) レーザ加工装置及び加工方法
EP0671238B1 (en) Laser marking apparatus
KR100995392B1 (ko) 디지털 마이크로미러 디바이스를 구비한 마킹 장치
JPH09308983A (ja) レーザ加工装置
JPS6096391A (ja) レ−ザ加工機
KR20180094481A (ko) 레이저 가공 장치
JPS6033595B2 (ja) レ−ザ加工装置
JP2581574B2 (ja) レ−ザ加工方法およびその装置
JPH058072A (ja) レーザ加工方法
JPH0314553B2 (en])
JPH05309483A (ja) レーザ加工方法および装置
JPH05337660A (ja) 被膜除去装置
JP3341114B2 (ja) レーザ加工装置及びレーザ加工方法
JPH0734680Y2 (ja) レーザ印字装置の印字パターン倍率変更装置
JPH0466283A (ja) レーザマーキング装置
JPH09192863A (ja) 物品のパターンカット方法
JP2769322B2 (ja) レーザマーキング装置
JPH08132268A (ja) レーザ加工装置
JPH0397364A (ja) 画像走査記録装置
JPH06170562A (ja) レ−ザマ−キング装置
JPS63260445A (ja) レ−ザ印字装置のマスク交換装置
WO2020090915A1 (ja) レーザ加工装置
JPH0985470A (ja) レーザマーキング装置
JP2001162384A (ja) 光加工方法及びその装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees